Hauptmaterialien
AgNi, AgC/BAg15CuP, AgNi/Cu, AgSnO₂, Au/AgNi/CuNi9Sn₂/BAg15CuP, AgZnO/BAg15CuP, etc
Produktvorteile
Special profile designs help reduce contact weight and support the miniaturization and lightweight design of relay products
Crossed moving and fixed contacts create line contact, resulting in lower current density and longer electrical life;
precise dimensions, bright surface finish, and low contact resistance
Stable and secure bonding between contacts and spring components, with strip forms suitable for automated welding
A wide variety of clad profile materials is available, with optional gold plating on the surface